New DS002 Copolyamide Hot Melt Adhesive Film: Empowering Textile Industrial LaminationPerformance and Superior Bonding

Tunsing Unveils All-New DS002 Copolyamide Hot Melt Adhesive Film: Empowering Textile & Industrial Lamination with Precise Rheological Performance and Superior Bonding

Date: April 23, 2024

Location: Shenzhen, China

Organization: Shenzhen Tunsing Plastic Products Co., Ltd.[cite: 1]

1. Composition & Product Positioning

Shenzhen Tunsing Plastic Products Co., Ltd. has officially published the latest technical dataset and thermodynamic analysis report (Version V1.3) for its flagship product, DS002[cite: 1].

DS002 is a thermoplastic hot melt adhesive film composed of high-grade Copolyamide, protected by Glassine release paper, and featuring a pale blue transparent appearance[cite: 1]. It supports repeated heating and plasticization for bonding and is engineered for high-demand applications[cite: 1]. Outstandingly resistant to 40°C laundering and dry cleaning, DS002 offers powerful adhesion to cotton, nylon, synthetic fibers, and blended fabrics, making it an ideal choice for apparel, seamless lamination, embroidery badges, footwear, and bags[cite: 1].

2. Technical Specifications & Physical Characteristics

3. Recommended Processing & Bonding Conditions

To achieve optimal bond strength and lamination quality (achieving an average peel strength of 1500–2400 g/25mm on cotton fabric backing with 0.08mm film thickness), Tunsing recommends a two-stage pressing process[cite: 1]:

1. First Lamination:

   • Mold Temperature: $130\ ^\circ\text{C} - 160\ ^\circ\text{C}$

     [cite: 1]

   • Pressing Time: 5 – 15 seconds[cite: 1]

   • Pressure: 0.3 – 0.6 MPa[cite: 1]

2. Second Lamination:

   • Mold Temperature: $130\ ^\circ\text{C} - 170\ ^\circ\text{C}$

     [cite: 1]

   • Pressing Time: 8 – 25 seconds[cite: 1]

   • Pressure: 0.3 – 0.6 MPa[cite: 1]

4. Thermal & Rheological Characterization

1. DSC Thermal Analysis (NETZSCH DSC 214): Conducted under a nitrogen atmosphere at a heating rate of $10\ ^\circ\text{C/min}$ ($-80\ ^\circ\text{C} \sim 200\ ^\circ\text{C}$): DS002 shows a glass transition temperature ($T_g$) near $25.5\ ^\circ\text{C}$[cite: 1]. A clear melting endothermic peak occurs near $124.0\ ^\circ\text{C}$ (peak area $16.64 - 19.07\text{ J/g}$, onset temperature $116.9\ ^\circ\text{C} - 120.3\ ^\circ\text{C}$), confirming the primary melting point[cite: 1].

2. Dynamic Rheological Analysis (Anton Paar Rheometer): Evaluated at a heating rate of $2.5\ ^\circ\text{C/min}$ to track storage modulus ($G'$), loss modulus ($G''$), and complex viscosity ($\eta^*$)[cite: 1]. The crossover point where $G'$ intersects $G''$ indicates the physical transition from a viscoelastic solid to a viscoelastic fluid[cite: 1]. For DS002, this phase transition temperature is precisely determined at $94.1\ ^\circ\text{C}$[cite: 1].